What is the difference between SOIC and DIP?
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs.
Are SOIC and sop the same?
Another name of SOP is called SOIC, JEDEC standard are called SOIC in the United States, and JEITA standard one is called SOP in Japan, and the body width of the former one is larger than the latter. It was developed to reduce space required on the substrate more than DIP.
What is soic8?
The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. The pad can be soldered to the PCB to dissipate heat.
What is 8dip?
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages.
What is the difference between SSOP and Tssop?
The main difference between TSSOP and SSOP is the width of the pads or pins, the pitch between the two remains . 65 mm the width of the pads varies from .
What is PLCC package?
The Plastic Leaded Chip Carrier, PLCC is a form of SMD integrated circuit package that can be used to enable ICs to be mounted on a printed circuit board either directly soldered to the board or within a socket. The leads are then in a form of a “J” which enables them to be soldered to the board.
What does QFP stand for in electronics?
Quad flat package (QFP) is also a surface mount integrated circuit package. In QFP, unlike QFN, the leads extend out in a gull-wing shape (L-shaped). This provides a good footing for the package during the PCB assembly process.
What is SOP package in IC?
Small Out-Line Package IC Also refer to a PSOP, a plastic SOP, again a much smaller IC with fewer pins. The term Small-Outline normally just means that the package is thinner than a pre-existing package style. The term doesn’t define the type of leads or terminals used with the package.
What is DIP package electronics?
In electronics, the acronym DIP when applied to switch types stands for ‘dual in-line package’. A dual in-line package switch, or DIP switch, is actually set of small manual electronic switches that are designed to be packaged with other circuits.
What is DIP in IC?
Dual-in-line package (DIP) This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing. Sometimes, instead of soldering an IC directly to the PCB, an IC socket is used. Using the socket allows for the DIP IC to be removed from and inserted into the PCB easily.
What is a 40 pin DIP?
Product Description. 40Pin IC Socket Wide – Dip40. IC sockets are generally for preventing damage to IC’s from soldering and while testing multiple circuits.These are made from Black Thermoplastic and tin-plated alloy contacts.
What does Tssop stand for?
Thin-shrink small outline package (TSSOP)
What is the 8-pin SOIC to dip adapter?
The SparkFun 8-Pin SOIC to DIP Adapter is a small PCB that lets you adapt SOIC packages into a DIP footprint. These are useful for modding and upgrading devices that use 8-pin DIP ICs, when the upgraded IC is only available in a SOIC footprint.
What is the difference between pins 1 and 8 in SOIC?
First, the solder pad for pin 1 is square, while the others are round. Second, pins 1 and 8 are marked in the legend silkscreened on the bottom of the board. This adapter is useful when you want to build a breadboard prototype using a chip that’s only available in SOIC.
What is the SOIC adapter for?
This adapter is useful when you want to build a breadboard prototype using a chip that’s only available in SOIC. It allows the chip to properly fit the rows of the breadboard.
What is the difference between the SOIC and dip footprint?
The pins of the DIP footprint are rotated 90° in relation to the pins of the SOIC. We covered the pin-1 markings for the SOIC in the assembly section. Pin 1 of the DIP footprint is marked two ways. First, the solder pad for pin 1 is square, while the others are round.